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Keywords: Advanced Modeling Principal Engineer, Location: Boise, ID

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Global Quality IC Package Design/Development Quality Assurance Principal Engineer

package design, manufacturing, or Quality & Reliability (Q&R). Experience with advanced packaging technologies (e.g., 3DI... acceleration modeling, and sampling statistics. Expert-level understanding of Chip-Package Interaction and effects...

Company: Micron
Location: Boise, ID
Posted Date: 19 Dec 2025

Principal Thermal Simulation Engineer, APTD

Maintain knowledge in semiconductor and advanced electronics packaging technologies such as High Bandwidth Memory (HBM... materials for simulation analysis. Use advanced EDA techniques to develop innovative semiconductor packages and package systems...

Company: Micron
Location: Boise, ID
Posted Date: 12 Dec 2025

Principal Design Engineer, TSV Packaging

Stay up-to-date on semiconductor and advanced electronics packaging technologies like High Bandwidth Memory (HBM..., Icepak, Flotherm. 8+ years working experience in Mechanical and Thermo-mechanical finite element analysis, modeling...

Company: Micron
Location: Boise, ID
Posted Date: 12 Dec 2025