. Job Description Key Responsibilities Advanced Electronics & Semiconductor Solutions (AESS) Supplier Quality Management Develop... Maintain up-to-date audit records, PPAP packaging, reliability data, FA reports, and supplier dashboard. Provide regular...
. Familiarity with chiplet-based architectures and advanced packaging technologies like 2.5D/3D integration is preferred..., and daily operations. The Company also offers advanced cloud capabilities to customers with high demand for artificial...
. Familiarity with chiplet-based architectures and advanced packaging technologies like 2.5D/3D integration is preferred... management, and daily operations. The Company also offers advanced cloud capabilities to customers with high demand...
communication Experience in OSAT, Fab, or advanced packaging (e.g., 2.5D/3D, HBM, interposer) (Preferred...Job Description: Summary: To support R&D activities for 2.5D wafer-level packaging (WLP) processesincluding...
communication Experience in OSAT, Fab, or advanced packaging (e.g., 2.5D/3D, HBM, interposer) (Preferred...Job Description: Purpose of the Job: To support R&D activities for 2.5D wafer-level packaging (WLP...
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel... interaction issues on an advanced scanning electron microscopy instrument. Acting independently, devise and drive innovative...
Develop and implement DFT strategies for advanced packaging. Conduct simulations for mechanical, thermal.... Support root cause analysis and corrective actions for reliability issues. Bachelor's or advanced degree in Engineering...
Familiarity with advanced packaging, wafer testing, component testing and module testing concept and flow. Strong troubleshooting... Comprehend new wafer fab and packaging technologies to identify and mitigate product reliability issues Develop and improve...
. Perform hands-on FA work using advanced FA tools and methodologies to uncover failure mechanisms. Work with various functional... OR Experience in surface morphology tools Preferred Qualifications Knowledge of IC assembly packaging design, process...
Knowledge of DRAM operation, fabrication process and semiconductor device physics Familiarity with advanced packaging, wafer... Comprehend new wafer fab and packaging technologies to identify and mitigate product reliability issues Develop and improve...
Familiarity with advanced packaging, wafer testing, component testing and module testing concept and flow. Strong troubleshooting... Comprehend new wafer fab and packaging technologies to identify and mitigate product reliability issues Develop and improve...
in semiconductor advanced packaging. Job Design and development of photolithography processes and materials Installation..., and other methodologies to enhance process stability and reduce variation Directly impacts yield and performance of advanced packaging...
Supports mass production and quality control in the advanced semiconductor packaging process Contributes to defect reduction..., and material behavior in reflow processes Experience in advanced packaging process such as 2.5D, fan-out and flip-chip...
of our Unit Module Development Team, leading exciting projects in Advanced Packaging, Photonics & Power platforms.... Job description: To set up processes as per technical requirements and lead Litho module UMD process engineers develop advanced packaging...
for the building blocks (‘all things TSV/TOV’) required for advanced packaging solutions needed in the product lines... and die level 2.5D and 3DHI processes. Drive understanding of failure modes. Facilitate advanced packaging interactions...
engineer with PLC or Servo Motion technologies. You possess an enhanced knowledge of automation technologies and are highly... across a wide range of industries — from packaging, pharmaceuticals, and plastics to energy, logistics, and transportation. At B&R...