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Keywords: Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering, Location: Singapore

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Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level... for product transfer to production High Volume Manufacturing Fabrication facilities Bachelor's or advanced degree in Engineering...

Company: Micron
Location: Singapore
Posted Date: 25 Sep 2025

Principal/Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

. Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level... for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements...

Company: Micron
Location: Singapore
Posted Date: 25 Sep 2025

Principal/Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering

, reliability and schedule requirements. Process Development: Establish and improve Wafer level process conditions and technologies... process management projects to deliver technology node requirements and scaling for next node. Evaluate and promote new...

Company: Micron
Location: Singapore
Posted Date: 25 Sep 2025

Engineer, APTD CEM - Advanced Packaging Equipment Engineering

Equipment Development: Develop and optimize advanced packaging equipment for technology enablement, including wafer...-level packaging and stacking Focus on improving equipment capability, enabling process improvements, reducing costs...

Company: Micron
Location: Singapore
Posted Date: 25 Sep 2025