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Keywords: Engineer, APTD CEM - Advanced Packaging Integration Engineering, Location: Singapore

Page: 1

Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering

Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging...: Develop and enable advanced package technology for various post-fab wafer finish and assembly processes Focus on improving...

Company: Micron
Location: Singapore
Posted Date: 10 Oct 2025

Engineer, APTD CEM - Advanced Packaging Integration Engineering

facilities Bachelor's or advanced degree in Engineering or Science is required Strong analytical, logical, and critical thinking...Technology Development: Develop and enable advanced package technology for various post-fab wafer finish and assembly...

Company: Micron
Location: Singapore
Posted Date: 25 Sep 2025

Engineer, APTD CEM - Advanced Packaging Equipment Engineering

Equipment Development: Develop and optimize advanced packaging equipment for technology enablement, including wafer... with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering...

Company: Micron
Location: Singapore
Posted Date: 25 Sep 2025

Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level... with organizational and business objectives Work closely with various teams, including the Package Integration, Assembly Engineering...

Company: Micron
Location: Singapore
Posted Date: 25 Sep 2025

Principal/Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.... Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level...

Company: Micron
Location: Singapore
Posted Date: 25 Sep 2025

Principal/Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering

Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly.../Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance...

Company: Micron
Location: Singapore
Posted Date: 25 Sep 2025