we are pursuing. Responsibilities will include, but not limited to, the following: High Bandwidth Memory (HBM) Program alignment.../expansion with key Micron customers, assist with Micron's HBM qualifications, and Technical Opportunity management with our HBM...
Supports NPI for advanced semiconductor customers (e.g., AI, HPC, and memory applications) Influences supplier..., Chemical, Mechanical, or related field) 3+ years of hands-on experience in semiconductor packaging process development...
, and reliability of high-value 2.5D packages Supports NPI for advanced semiconductor customers (e.g., AI, HPC, and memory applications..., Electronics, Chemical, Mechanical, or related field) 3+ years of hands-on experience in semiconductor packaging process...