_ THE ROLE: We are looking for a candidate that can drive advanced 2.5D/3D IC packaging technology development... design for manufacturing (DFM) and to integrate packaging needs into product design. Drive for supplier engagement...
, methodology, and advanced packaging Experience in validating Power Distribution Network (PDN), IR/EM, Thermals for 3D-IC... on Chip (SoC) and IP for data center applications. ASIC Engineer, Physical Design Responsibilities Develop and own...