_ THE ROLE: The job role will be responsible for advanced 2.5D & 3D IC packaging technology evaluation, design enablement... advanced packaging technology and drive system-technology co-optimization (STCO) of FPGA and ASIC products at advanced nodes...
, with focus on Advanced IC Package Routing, Technologies, and Flows. As an IC Packaging Product Engineer..., you will be responsible for driving innovation and expanding Cadence IC Packaging Advanced Routing and Automated Solutions leadership...
, with focus on Advanced IC Package Routing, Technologies, and Flows. As an IC Packaging Product Engineer..., you will be responsible for driving innovation and expanding Cadence IC Packaging Advanced Routing and Automated Solutions leadership...