Find your dream job now!

Click on Location links to filter by Job Title & Location.
Click on Company links to filter by Company & Location.
For exact match, enclose search terms in "double quotes".

Keywords: Principal Engineer Equipment Engineering (Advanced Packaging), Location: Singapore

Page: 1

Principal Engineer Equipment Engineering (Advanced Packaging)

Equipment Engineer to become part of our starting 300mm Advance Packaging Center, Singapore. The primary responsibilities... discipline is required Relevant working experiences in various Metrology Equipment in Advanced packaging Bonder (TEL W2W/ BESI...

Company: GlobalFoundries
Location: Singapore
Posted Date: 05 Oct 2025

Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering

Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging...: Develop and enable advanced package technology for various post-fab wafer finish and assembly processes Focus on improving...

Company: Micron
Location: Singapore
Posted Date: 09 Oct 2025

Principal/Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.... Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer-level...

Company: Micron
Location: Singapore
Posted Date: 25 Sep 2025

Principal/Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering

equipment and materials to enhance process capabilities Set up process parameters for a variety of semiconductor equipment... Evaluate, promote, and plan for new equipment and materials Ensure defense coverage through process, measurement, inspection...

Company: Micron
Location: Singapore
Posted Date: 25 Sep 2025

Package Health - Principal/Staff/Senior Engineer, Advanced Packaging Technology Development

), preferably in packaging, test, or reliability engineering. Hands-on experience with simulation tools and test equipment, working...Develop and implement DFT strategies for advanced packaging. Conduct simulations for mechanical, thermal...

Company: Micron
Location: Singapore
Posted Date: 02 Nov 2025

Principal/Senior Engineer, Advanced Package Metrology-Real-Time Defect Analysis (MRDA)

techniques to enable advanced packaging technologies. Recipe Development and Optimization: Develop and optimize metrology recipes..., or other related technical fields 2 or more years of semiconductor process or equipment engineering experience, preferably in wafer...

Company: Micron
Location: Singapore
Posted Date: 09 Oct 2025

Principal Engineer, Quality - High Bandwidth Memory

Familiarity with advanced packaging, wafer testing, component testing and module testing concept and flow. Strong troubleshooting..., and/or ATE (Auto Test Equipment) preferred Familiarity with Perl, C++, Python, HTML, CGI, or Java preferred Product Engineering Product...

Company: Micron
Location: Singapore
Posted Date: 02 Oct 2025