Summary: We are seeking a highly motivated Principal IC Packaging Engineer to lead the development of advanced integrated... circuit (IC) packaging technologies. This role focuses on spearheading new product introductions for cutting-edge package...
in packaging technology development in assembly of IC packages including PoP, SiP, 2/2.5D Understanding semiconductor industry...Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group Packaging Engineering General...
. In this role, you will be a member of a technical team working closely with IC Design, Software, Systems and Operations engineering... Equipment: Advantest or Teradyne is a plus. Principal Duties and Responsibilities: Applies Hardware knowledge...