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Keywords: Principal Process Engineer, Die Bonding, Location: Boise, ID

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Principal Process Engineer, Die Bonding

Develop, diagnose, and resolve various die bonding process technologies Coordinate and execute process, equipment..., and material evaluation/optimization initiatives and implement changes at process step Lead and participate in continuous yield...

Company: Micron
Location: Boise, ID
Posted Date: 11 Oct 2025

Principal Process Engineer, APTD Bonding

Identify, diagnose and resolve assembly process related problems Coordinate and complete process, equipment..., and material evaluation / optimization initiatives and make changes at process step Lead / participate in continuous yield...

Company: Micron
Location: Boise, ID
Posted Date: 14 Aug 2025

Principal Thermal Simulation Engineer, APTD

thermal budget and thermal compression bonding process as well as Hybrid and other innovative bonding processing methods. Work...

Company: Micron
Location: Boise, ID
Posted Date: 08 Oct 2025