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Keywords: R&D Engineer - Semiconductor Heterogeneous Integration, Location: Santa Rosa, CA

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R&D Engineer - Semiconductor Heterogeneous Integration

(SMT) processes Die singulation Semiconductor fabrication processes Heterogeneous integration, advanced packaging... in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries...

Posted Date: 20 Nov 2025

R&D Engineer - Semiconductor Heterogeneous Integration

(SMT) processes Die singulation Semiconductor fabrication processes Heterogeneous integration, advanced packaging... world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets...

Posted Date: 19 Nov 2025

R&D III-V Semiconductor Back-End-Of-Line Integration Engineer

, has an opening for an R&D III-V Back-End-Of-Line Integration Engineer. This position is within the High Frequency Technology Center... in Santa Rosa, CA Responsibilities: The focus of the Back-End-Of-Line Integration Engineer position is the development...

Posted Date: 26 Oct 2025

R&D III-V Semiconductor Back-End-Of-Line Integration Engineer

company, has an opening for an R&D III-V Back-End-Of-Line Integration Engineer. This position is within the High Frequency... will be based in our headquarters in Santa Rosa, CA Responsibilities The focus of the Back-End-Of-Line Integration Engineer...

Posted Date: 24 Oct 2025

Process Integration Engineer – SiP Yield

Overview: Keysight Technologies has a new position for a Process Integration Engineer in the Semiconductor... Heterogeneous Integration fab in Santa Rosa, CA. The Integration Engineer will lead process improvement opportunities to maximize...

Posted Date: 25 Oct 2025

Process Integration Engineer – SiP Yield

Semiconductor Heterogeneous Integration fab in Santa Rosa, CA. The Integration Engineer will lead process improvement opportunities...Job Description: Overview Keysight Technologies has a new position for a Process Integration Engineer in the...

Posted Date: 23 Oct 2025

Process Engineer: System in Package

) processes. Die singulation and semiconductor fabrication processes. Heterogeneous integration and advanced packaging... System-in-Package (SiP) R&D Engineer to lead the development of next-generation SiP modules integrated with microwave...

Posted Date: 27 Nov 2025

Process Engineer: System in Package

) processes. Die singulation and semiconductor fabrication processes. Heterogeneous integration and advanced packaging... motivated System-in-Package (SiP) R&D Engineer to lead the development of next-generation SiP modules integrated with microwave...

Posted Date: 25 Nov 2025