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Keywords: Senior/ Engineer, Advanced Packaging Wafer Level Technology - Bumping (Plating/Photo/Wet), Location: Singapore

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Senior/ Engineer, Advanced Packaging Wafer Level Technology - Bumping (Plating/Photo/Wet)

, preferably in wafer bonding, plating, warpage control and packaging field Strong understanding of process flows, process... post-fab wafer finishing processes in semiconductor manufacturing to meet performance, cost, manufacturability, quality...

Apply Now
Company: Micron
Location: Singapore
Posted Date: 01 Aug 2025

Senior/ Engineer, Advanced Packaging Wafer Level Technology - Bumping (Plating/Photo/Wet)

, preferably in wafer bonding, plating, warpage control and packaging field Strong understanding of process flows, process... post-fab wafer finishing processes in semiconductor manufacturing to meet performance, cost, manufacturability, quality...

Apply Now
Company: Micron
Location: Singapore
Posted Date: 01 Jul 2025

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