Own package-level process integration across 2.5D/3D flows (wafer-to-wafer, chip-to-wafer, advanced interconnects...), defining specs and process windows that meet high performance targets for HPC/AI products Develop and integrate semiconductor...
Develop new or modified process formulations, define equipment requirements and specifications, and review processing... techniques and methods Identify, diagnose, and resolve assembly process related problems Coordinate and execute process...